Publication:
Characterization of the thermal impact of Cu-Cu bonds achieved using TSVs on hot spot dissipation in 3D stacked ICs
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1921 since deposited on 2021-10-19
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Acq. date: 2026-01-09
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Views
1921 since deposited on 2021-10-19
1last month
1last week
Acq. date: 2026-01-09
Citations