Browsing by author "Webers, Tomas"
Now showing items 1-20 of 34
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10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process
Derakhshandeh, Jaber; Capuz, Giovanni; Cherman, Vladimir; Inoue, Fumihiro; De Preter, Inge; Hou, Lin; Bex, Pieter; Gerets, Carine; Duval, Fabrice; Webers, Tomas; Bertheau, Julien; Van Huylenbroeck, Stefaan; Phommahaxay, Alain; Shafahian, Ehsan; Van der Plas, Geert; Beyne, Eric; Miller, Andy; Beyer, Gerald (2020) -
21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization
Vega Gonzalez, Victor; Wilson, Chris; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Versluijs, Janko; Blanco, Victor; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Lesniewska, Alicja; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Pardons, Katrien; Barla, Kathy; Tokei, Zsolt (2019) -
3D SoP integration of a BAN sensor node
Brebels, Steven; Sanders, Steven; Winters, Christophe; Webers, Tomas; Vaesen, Kristof; Carchon, Geert; Gyselinckx, Bert; De Raedt, Walter (2005-06) -
3D stacking using bump-less process for sub 10μm pitches
Derakhshandeh, Jaber; De Preter, Inge; Gerets, Carine; Hou, Lin; Heylen, Nancy; Beyne, Eric; Beyer, Gerald; Slabbekoorn, John; Dubey, Vikas; Jourdain, Anne; Potoms, Goedele; Inoue, Fumihiro; Jamieson, Geraldine; Vandersmissen, Kevin; Suhard, Samuel; Webers, Tomas; Capuz, Giovanni; Wang, Teng; Rebibis, Kenneth June; Miller, Andy (2016) -
3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hybrid Cu/dielectric Bonding versus Dielectric via-last Bonding
Oprins, Herman; Cherman, Vladimir; Webers, Tomas; Kim, Soon-Wook; de Vos, Joeri; Van der Plas, Geert; Beyne, Eric (2020) -
A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
Derakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas; Bex, Pieter; Jamieson, Geraldine; Maehara, Masataka; Shafahian, Ehsan; Bertheau, Julien; Beyne, Eric; La Tulipe, Douglas Charles; Beyer, Gerald; Van der Plas, Geert; Miller, Andy (2021) -
Characterization and benchmarking of the low inter-tier thermal resistance of 3D hybrid Cu/dielectric wafer-to-wafer bonding
Oprins, Herman; Cherman, Vladimir; Webers, Tomas; Salahouelhadj, Abdellah; Kim, Soon-Wook; Peng, Lan; Van der Plas, Geert; Beyne, Eric (2017-03) -
Comprehensive study of postprocessed copper heat sinks on smart power drivers for thermal SOA improvement
Van den Bosch, Geert; Driessens, Evelien; Webers, Tomas; Elattari, Brahim; Wojchiechowski, Dominique; Gassot, Pierre; Moens, Peter; Groeseneken, Guido (2005-04) -
Confined IMCs for low temperature and high throughput D2W bonding
Derakhshandeh, Jaber; La Tulipe, Douglas Charles; Capuz, Giovanni; Cherman, Vladimir; Gerets, Carine; Cochet, Tom; Shafahian, Ehsan; De Preter, Inge; Jamieson, Geraldine; Webers, Tomas; Beyne, Eric; Beyer, Gerald; Miller, Andy (2022) -
Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G
Sun, Xiao; Slabbekoorn, John; Sinha, Siddhartha; Bex, Pieter; Pinho, Nelson; Webers, Tomas; Velenis, Dimitrios; Miller, Andy; Collaert, Nadine; Van der Plas, Geert; Beyne, Eric (2022) -
Design and characterization of a post-processed copper heat sink for smart power drivers
Van den Bosch, Geert; Webers, Tomas; Driessens, Evelien; Elattari, Brahim; Wojciechowski, Dominique; Gassot, Pierre; Moens, Peter; Groeseneken, Guido (2005-04) -
Die to wafer 3D stacking for below 10μm pitch microbumps
Derakhshandeh, Jaber; Hou, Lin; De Preter, Inge; Gerets, Carine; Suhard, Samuel; Dubey, Vikas; Jamieson, Geraldine; Inoue, Fumihiro; Webers, Tomas; Bex, Pieter; Capuz, Giovanni; Beyne, Eric; Slabbekoorn, John; Wang, Teng; Jourdain, Anne; Beyer, Gerald; Rebibis, Kenneth June; Miller, Andy (2016) -
Electro-migration behavior of Pb-free flip chip bumps
Labie, Riet; Webers, Tomas; Swinnen, Bart; Beyne, Eric (2005) -
Electromigration failure mechanisms for different flip chip configurations
Labie, Riet; Webers, Tomas; Winters, Christophe; Cherman, Vladimir; Croes, Kristof; Vandevelde, Bart; Dosseul, Franck (2011) -
Electromigration, fuse and thermo-mechanical performance of solder bump versus Cu pillar flip chip assemblies
Vandevelde, Bart; Labie, Riet; Cherman, Vladimir; Webers, Tomas; Winters, Christophe; Beyne, Eric; Dosseul, Franck (2011) -
Extending on-die wiring hierarchy with wafer-level packaging concepts
Balachandran, Jayaprakash; Brebels, Steven; Carchon, Geert; Webers, Tomas; De Raedt, Walter; Nauwelaers, Bart; Beyne, Eric (2004) -
Failure analysis work flow for electrical shorts in triple stacked 3D TSV daisy chains
Gaudestad, Jan; Irizco, A.; De Wolf, Ingrid; Wang, Teng; Webers, Tomas; Kelley, R.; Morrison, T.; Madala, S. (2014) -
FCOB: packaging issues for RF-MEMS applications and reliability study
Stoukatch, Serguei; Webers, Tomas; Winters, Christophe; Ratchev, Petar; De Wolf, Ingrid; Baert, Kris; Beyne, Eric; Oya, Yoichi; Okubora, Akihiko (2005) -
High density 3-D stack structure for SIP solutions
Stoukatch, Serguei; Ho, Meng; Vaesen, Kristof; Webers, Tomas; Carchon, Geert; De Raedt, Walter; Beyne, Eric; De Baets, Johan; Naem, Abdalla; Poddar, Anindya (2003) -
High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SL/D)
Beyne, Eric; Van Hoof, Rita; Webers, Tomas; Brebels, Steven; Rossi, S.; Lechleiter, F.; Di Ianni, M.; Ostmann, A. (2001)