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Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G
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Authors
Sun, Xiao
;
Slabbekoorn, John
;
Sinha, Siddhartha
;
Bex, Pieter
;
Pinho, Nelson
;
Webers, Tomas
;
Velenis, Dimitrios
;
Miller, Andy
;
Collaert, Nadine
;
Van der Plas, Geert
;
Beyne, Eric
DOI
10.1109/ECTC51906.2022.00009
EISBN
978-1-6654-7943-1
ISSN
0569-5503
Conference
72nd IEEE Electronic Components and Technology Conference (ECTC)
Journal
na
Title
Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G
Publication type
Proceedings paper
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Date
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2
20.500.12860/40440.2
*
2023-04-27T15:02:54Z
validation by library/open access desk
1
20.500.12860/40440
2022-09-17T02:52:06Z
*Selected version
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