Browsing by author "Miller, Andy"
Now showing items 1-20 of 170
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10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process
Derakhshandeh, Jaber; Capuz, Giovanni; Cherman, Vladimir; Inoue, Fumihiro; De Preter, Inge; Hou, Lin; Bex, Pieter; Gerets, Carine; Duval, Fabrice; Webers, Tomas; Bertheau, Julien; Van Huylenbroeck, Stefaan; Phommahaxay, Alain; Shafahian, Ehsan; Van der Plas, Geert; Beyne, Eric; Miller, Andy; Beyer, Gerald (2020) -
3D Heterogeneous integration - High density FOWLP and lithography
Miller, Andy; Beyer, Gerald (2018) -
3D Heterogeneous Package Integration of Air/Magnetic Core Inductor: 89%-Efficiency Buck Converter with Backside Power Delivery Network
Sun, Xiao; Lin, Hesheng; Velenis, Dimitrios; Slabbekoorn, John; Talmelli, Giacomo; Bex, Pieter; Sterken, Tom; Lauwereins, Rudy; Adelmann, Christoph; Miller, Andy; Van der Plas, Geert; Beyne, Eric (2020) -
3D IC assembly using thermal compression bonding and wafer-level underfill – strategies for quality improvement and throughput enhancement
Wang, Teng; Bex, Pieter; Capuz, Giovanni; Duval, Fabrice; Inoue, Fumihiro; Gerets, Carine; Bertheau, Julien; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Natsukawa, Masanori; Mitsukura, Kazuyuki; Hatakeyama, Keiichi (2016) -
3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures
De Preter, Inge; Derakhshandeh, Jaber; Nagano, Fuya; Houshmand Sharifi, Shamin; Hou, Lin; Bex, Pieter; Suhard, Samuel; Shibata, Toshiaki; Yukinori, Oda; Hashimoto, Shigeo; Lieten, Ruben; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2017) -
3D stacking of Co and Ni based microbumps
De Preter, Inge; Derakhshandeh, Jaber; Hou, Lin; Gerets, Carine; Wang, Teng; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
3D stacking using bump-less process for sub 10μm pitches
Derakhshandeh, Jaber; De Preter, Inge; Gerets, Carine; Hou, Lin; Heylen, Nancy; Beyne, Eric; Beyer, Gerald; Slabbekoorn, John; Dubey, Vikas; Jourdain, Anne; Potoms, Goedele; Inoue, Fumihiro; Jamieson, Geraldine; Vandersmissen, Kevin; Suhard, Samuel; Webers, Tomas; Capuz, Giovanni; Wang, Teng; Rebibis, Kenneth June; Miller, Andy (2016) -
3D-SoC integration utilizing high accuracy wafer level bonding
Peng, Lan; Kim, Soon-Wook; Heylen, Nancy; Reichardt, Maik; Kurz, Florian; Wagenleitner, Thomas; Sleeckx, Erik; Struyf, Herbert; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
A highly reliable 1.4μm pitch via-last TSV module for wafer-to-wafer hybrid bonded 3D-SOC systems
Van Huylenbroeck, Stefaan; De Vos, Joeri; El-Mekki, Zaid; Jamieson, Geraldine; Tutunjyan, Nina; Muga, Karthik; Stucchi, Michele; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
A highly reliable 1×5μm via-last TSV module
Van Huylenbroeck, Stefaan; Li, Yunlong; De Vos, Joeri; Jamieson, Geraldine; Tutunjyan, Nina; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018) -
A novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-μm pitch
Podpod, Arnita; Slabbekoorn, John; Phommahaxay, Alain; Duval, Fabrice; Salahouelhadj, Abdellah; Gonzalez, Mario; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018) -
A novel intermetallic compound insertion bonding to improve throughput for 3D die to wafer stacking
Hou, Lin; Derakhshandeh, Jaber; Capuz, Giovanni; Lofrano, Melina; Beyne, Eric; Miller, Andy; Beyer, Gerald; De Wolf, Ingrid (2020) -
A novel method for characterization of Ultra Low Viscosity NCF layers using TCB for 3D Assembly
Capuz, Giovanni; Lofrano, Melina; Gerets, Carine; Duval, Fabrice; Bex, Pieter; Derakhshandeh, Jaber; Phommahaxay, Alain; Beyne, Eric; Miller, Andy; Vanstreels, Kris (2020) -
A study of microbump metrology and defectivity at 20m pitch and below for 3D TSV stacking
Miller, Andy; Haensel, Leander; Vandeweyer, Tom; Beyne, Eric; Wiesiollek, Markus; Eisenbach, Heiko; Filzen, Marc; Wen, Youxian; Sood, Sumant (2015) -
A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
Derakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas; Bex, Pieter; Jamieson, Geraldine; Maehara, Masataka; Shafahian, Ehsan; Bertheau, Julien; Beyne, Eric; La Tulipe, Douglas Charles; Beyer, Gerald; Van der Plas, Geert; Miller, Andy (2021) -
Advanced dicing technologies for combination of wafer to wafer and collective die to wafer fusion bonding
Inoue, Fumihiro; Phommahaxay, Alain; Podpod, Arnita; Suhard, Samuel; Hoshino, Hitoshi; Berthold, Moeller; Sleeckx, Erik; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric (2019) -
Advanced optical lithography: double patterning options for 32 and 22nm node
Vandeweyer, Tom; Maenhoudt, Mireille; Vangoidsenhoven, Diziana; Gronheid, Roel; Versluijs, Janko; Miller, Andy; Bekaert, Joost; Truffert, Vincent; Wiaux, Vincent (2009) -
Advances in Photosensitive Polymer Based Damascene RDL Processes: Toward Submicrometer Pitches With More Metal Layers
Chery, Emmanuel; Slabbekoorn, John; Pinho, Nelson; Miller, Andy; Beyne, Eric (2021) -
Advances in SiCN-SiCN bonding with high accuracy wafer-to-wafer (W2W) stacking technology
Peng, Lan; Kim, Soon-Wook; Iacovo, Serena; Inoue, Fumihiro; Phommahaxay, Alain; Sleeckx, Erik; De Vos, Joeri; Zinner, Dominik; Thomas, Wagenleitner; Thomas, Uhrmann; Markus, Wimplinger; Ben, Schoenaers; Andre, Stesmans; Afanasiev, Valeri; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018)