Browsing by author "Miller, Andy"
Now showing items 21-40 of 170
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Advances in temporary carrier technology for high density fan-out device build-up
Podpod, Arnita; Phommahaxay, Alain; Bex, Pieter; Slabbekoorn, John; Bertheau, Julien; Salahouelhadj, Abdellah; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric; Guerrero, Alice; Yess, Kim; Arnold, Kim (2019) -
An alternative 3D packaging route thru wafer reconstruction
Cadacio Jr., Francisco; Wang, Teng; Salahouelhadj, Abdellah; Capuz, Giovanni; Gerets, Carine; Potoms, Goedele; Verwoerdt, Rudy; Rebibis, Kenneth June; Beyer, Gerald; Miller, Andy; Beyne, Eric; Brouwer, Erik (2015) -
An investigation into damage-free thin die pick and place for 3D stacking
Malachowski, Karl; Gonzales, Dennis; Miller, Andy; La Manna, Antonio; Hajdarevic, Zlatko; Schnegg, Fabian; Arzberger, Anton (2011-12) -
Challenges and solutions on pre-assembly processes for thinned 3D wafers with micro-bumps on the backside
Podpod, Arnita; Demeurisse, Caroline; Rebibis, Kenneth June; Gerets, Carine; Phommahaxay, Alain; Capuz, Giovanni; Duval, Fabrice; Sleeckx, Erik; Struyf, Herbert; Miller, Andy; Beyne, Eric; Beyer, Gerald (2014) -
Characterization of extreme Si thinning proces for wafer-to-wafer stacking
Inoue, Fumihiro; Jourdain, Anne; De Vos, Joeri; Peng, Lan; Liebens, Maarten; Armini, Silvia; Uedono, Akira; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Sleeckx, Erik (2016) -
Characterization of inorganic dielectric layers for low thermal budget wafer to wafer bonding
Inoue, Fumihiro; Peng, Lan; Phommahaxay, Alain; Kim, Soon-Wook; De Vos, Joeri; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2017) -
Characterization of optical end-point detection for via reveal processing
Rassoul, Nouredine; Jourdain, Anne; Tutunjyan, Nina; De Vos, Joeri; Sardo, Stefano; Piumi, Daniele; Miller, Andy; Beyne, Eric; Walsby, Edward; Ashraf, Huma; Thomas, Dave (2018) -
Cobalt UBM for fine pitch microbump applications in 3DIC
Derakhshandeh, Jaber; De Preter, Inge; Vandersmissen, Kevin; Dictus, Dries; Di Piazza, Luca; Hou, Lin; Guerrieri, Stefano; Vakanas, George; Armini, Silvia; Daily, Robert; Lesniewska, Alicja; Vandelaer, Yannick; Van De Peer, Myriam; Slabbekoorn, John; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2015) -
Comparing SAM (Self-Assembled Monolayer) deposition methods to passivate copper microbumps for 3D stacking
Houshmand Sharifi, Shamin; Derakhshandeh, Jaber; Armini, Silvia; De Preter, Inge; Bex, Pieter; Hou, Lin; Bartha, Johan W; Neumann, Volker; Herregods, Sebastiaan; Nagano, Fuya; Rebibis, Kenneth June; Miller, Andy; De Wolf, Ingrid; Beyer, Gerald; Beyne, Eric (2017) -
Comparison between wet and dry silicon via reveal in 3D backside processing
Thomas, Dave; Hopkins, Janet; Ashraf, Huma; Patel, Jash; Ansell, Oliver; Jourdain, Anne; De Vos, Joeri; Miller, Andy; Beyne, Eric (2015) -
Comparison of electrical properties of thermo-compression bonded 3D stacks using a liquid and a dry-film wafer level underfills
Duval, Fabrice; Wang, Teng; Capuz, Giovanni; Gerets, Carine; Miller, Andy; Rebibis, Kenneth June; Beyne, Eric (2015) -
Comparison of LFLE and LELE manufacturability
Miller, Andy; Maenhoudt, Mireille; Vangoidsenhoven, Diziana; Murdoch, Gayle; Shioya, Takeo; Hoshiko, Kenji (2008) -
Confined IMCs for low temperature and high throughput D2W bonding
Derakhshandeh, Jaber; La Tulipe, Douglas Charles; Capuz, Giovanni; Cherman, Vladimir; Gerets, Carine; Cochet, Tom; Shafahian, Ehsan; De Preter, Inge; Jamieson, Geraldine; Webers, Tomas; Beyne, Eric; Beyer, Gerald; Miller, Andy (2022) -
Cost comparison of different TSV implementation options
Velenis, Dimitrios; Van Huylenbroeck, Stefaan; Heylen, Nancy; Vandersmissen, Kevin; Jourdain, Anne; Miller, Andy; Beyne, Eric (2016) -
Cost components for 3D system integration
Velenis, Dimitrios; Detalle, Mikael; Van Huylenbroeck, Stefaan; Jourdain, Anne; Phommahaxay, Alain; Slabbekoorn, John; Wang, Teng; Rebibis, Kenneth June; Marinissen, Erik Jan; Miller, Andy; Beyer, Gerald; Beyne, Eric (2014) -
Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G
Sun, Xiao; Slabbekoorn, John; Sinha, Siddhartha; Bex, Pieter; Pinho, Nelson; Webers, Tomas; Velenis, Dimitrios; Miller, Andy; Collaert, Nadine; Van der Plas, Geert; Beyne, Eric (2022) -
Cu-Cu insertion bonding technique using photosensitive polymer as WLUF
Potoms, Goedele; Wang, Teng; Derakhshandeh, Jaber; Daily, Robert; Capuz, Giovanni; Gonzalez, Mario; Beyer, Gerald; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric (2014) -
Decoupling capacitor integration in passive silicon interposer
Detalle, Mikael; Roda Neve, Cesar; Nolmans, Philip; Miller, Andy; La Manna, Antonio; Van der Plas, Geert; Beyer, Gerald; Beyne, Eric (2015) -
Defect learning methodology applied to microbump process at 20μm pitch and below
Liebens, Maarten; Slabbekoorn, John; Miller, Andy; Beyne, Eric; Stoerring, M.; Hiebert, S.; Cross, A. (2018) -
Demonstration of a collective hybrid die-to-wafer integration
Suhard, Samuel; Phommahaxay, Alain; Kennes, Koen; Bex, Pieter; Fodor, Ferenc; Beyne, Eric; Liebens, Maarten; Slabbekoorn, John; Miller, Andy; Beyer, Gerald (2020)