Toggle navigation
My submissions
Login
Toggle navigation
View item
imec Publications Repository
imec Publications
Conference contributions
View item
imec Publications Repository
imec Publications
Conference contributions
View item
JavaScript is disabled for your browser. Some features of this site may not work without it.
Advances in temporary carrier technology for high density fan-out device build-up
View/
open
40132.pdf (1011.Kb)
Metadata
Show full item record
Authors
Podpod, Arnita
;
Phommahaxay, Alain
;
Bex, Pieter
;
Slabbekoorn, John
;
Bertheau, Julien
;
Salahouelhadj, Abdellah
;
Sleeckx, Erik
;
Miller, Andy
;
Beyer, Gerald
;
Beyne, Eric
;
Guerrero, Alice
;
Yess, Kim
;
Arnold, Kim
Conference
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
Title
Advances in temporary carrier technology for high density fan-out device build-up
Publication type
Proceedings paper
Embargo date
9999-12-31
Collections
Conference contributions
Search imec Publications Repository
This collection
Browse
All of imec Publications Repository
Collections
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
This collection
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
My account
login
NoThumbnail