Publication:

Advances in temporary carrier technology for high density fan-out device build-up

Date

2019
Proceedings Paper
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dc.contributor.authorPodpod, Arnita
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorBex, Pieter
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorBertheau, Julien
dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorSleeckx, Erik
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorGuerrero, Alice
dc.contributor.authorYess, Kim
dc.contributor.authorArnold, Kim
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorBertheau, Julien
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorGuerrero, Alice
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-27T16:13:58Z
dc.date.available2021-10-27T16:13:58Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33813
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8811142
dc.source.beginpage340
dc.source.conference2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedate28/05/2019
dc.source.conferencelocationLas Vegas USA
dc.source.endpage345
dc.title

Advances in temporary carrier technology for high density fan-out device build-up

dc.typeProceedings paper
dspace.entity.typePublication
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