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Conference contributions
Advances in temporary carrier technology for high density fan-out device build-up
Publication:
Advances in temporary carrier technology for high density fan-out device build-up
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Date
2019
Proceedings Paper
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40132.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Podpod, Arnita
;
Phommahaxay, Alain
;
Bex, Pieter
;
Slabbekoorn, John
;
Bertheau, Julien
;
Salahouelhadj, Abdellah
;
Sleeckx, Erik
;
Miller, Andy
;
Beyer, Gerald
;
Beyne, Eric
;
Guerrero, Alice
;
Yess, Kim
;
Arnold, Kim
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1991
since deposited on 2021-10-27
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Acq. date: 2025-12-11
Citations
Metrics
Views
1991
since deposited on 2021-10-27
2
last month
Acq. date: 2025-12-11
Citations