An alternative 3D packaging route thru wafer reconstruction

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Author(s)

Cadacio Jr., Francisco

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;

Salahouelhadj, Abdellah

;

Capuz, Giovanni

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;

Potoms, Goedele

;

Verwoerdt, Rudy

;

Rebibis, Kenneth June

;

;

;

;

Metrics

1960 since deposited on 2021-10-22

Acq. date: 2025-10-27