Publication:

An alternative 3D packaging route thru wafer reconstruction

Date

2015
Proceedings Paper
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dc.contributor.authorCadacio Jr., Francisco
dc.contributor.authorWang, Teng
dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorGerets, Carine
dc.contributor.authorPotoms, Goedele
dc.contributor.authorVerwoerdt, Rudy
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorBrouwer, Erik
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorPotoms, Goedele
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T18:36:30Z
dc.date.available2021-10-22T18:36:30Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25030
dc.source.beginpage1
dc.source.conference17th Electronic Packaging Technology Conference - EPTC
dc.source.conferencedate2/12/2015
dc.source.conferencelocationLeuven Belgium
dc.source.endpage5
dc.title

An alternative 3D packaging route thru wafer reconstruction

dc.typeProceedings paper
dspace.entity.typePublication
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