An investigation into damage-free thin die pick and place for 3D stacking

Thumbnail
Metadata
Show full item record
Authors
Malachowski, Karl; Gonzales, Dennis; Miller, Andy; La Manna, Antonio; Hajdarevic, Zlatko; Schnegg, Fabian; Arzberger, Anton
Conference
13th Electronics Packaging Technology Conference - EPTC
Title
An investigation into damage-free thin die pick and place for 3D stacking
Publication type
Proceedings paper
Collections