Publication:
An investigation into damage-free thin die pick and place for 3D stacking
Date
| dc.contributor.author | Malachowski, Karl | |
| dc.contributor.author | Gonzales, Dennis | |
| dc.contributor.author | Miller, Andy | |
| dc.contributor.author | La Manna, Antonio | |
| dc.contributor.author | Hajdarevic, Zlatko | |
| dc.contributor.author | Schnegg, Fabian | |
| dc.contributor.author | Arzberger, Anton | |
| dc.contributor.imecauthor | Miller, Andy | |
| dc.contributor.imecauthor | La Manna, Antonio | |
| dc.date.accessioned | 2021-10-19T15:53:17Z | |
| dc.date.available | 2021-10-19T15:53:17Z | |
| dc.date.issued | 2011-12 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/19359 | |
| dc.source.conference | 13th Electronics Packaging Technology Conference - EPTC | |
| dc.source.conferencedate | 7/12/2011 | |
| dc.source.conferencelocation | Singapore | |
| dc.title | An investigation into damage-free thin die pick and place for 3D stacking | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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