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An investigation into damage-free thin die pick and place for 3D stacking
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An investigation into damage-free thin die pick and place for 3D stacking
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Date
2011
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Malachowski, Karl
;
Gonzales, Dennis
;
Miller, Andy
;
La Manna, Antonio
;
Hajdarevic, Zlatko
;
Schnegg, Fabian
;
Arzberger, Anton
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1980
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Acq. date: 2026-07-15
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Views
1980
since deposited on 2021-10-19
1
last month
1
last week
Acq. date: 2026-07-15
Citations