Authors

Inoue, Fumihiro; Peng, Lan; Phommahaxay, Alain; Kim, Soon-Wook; De Vos, Joeri; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric

Conference

5th International Workshop on Low Temperature Bonding for 3D Integration - LTB-3D

Title

Characterization of inorganic dielectric layers for low thermal budget wafer to wafer bonding

Publication type

Proceedings paper

Embargo date

9999-12-31