Publication:

Comparing SAM (Self-Assembled Monolayer) deposition methods to passivate copper microbumps for 3D stacking

Date

2017
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Author(s)

Houshmand Sharifi, Shamin  
;
Derakhshandeh, Jaber  
;
Armini, Silvia  
;
De Preter, Inge  
;
Bex, Pieter  
;
Hou, Lin  
;
Bartha, Johan W
;
Neumann, Volker
;
Herregods, Sebastiaan  
;
Nagano, Fuya  
;
Rebibis, Kenneth June  
;
Miller, Andy  
;
De Wolf, Ingrid  
;
Beyer, Gerald  
;
Beyne, Eric  

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Abstract

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