Characterization of extreme Si thinning proces for wafer-to-wafer stacking

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Authors
Inoue, Fumihiro; Jourdain, Anne; De Vos, Joeri; Peng, Lan; Liebens, Maarten; Armini, Silvia; Uedono, Akira; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Sleeckx, Erik
Conference
IEEE 66th Electronic Components and Technology Conference - ECTC
Title
Characterization of extreme Si thinning proces for wafer-to-wafer stacking
Publication type
Proceedings paper
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