Publication:

Characterization of extreme Si thinning proces for wafer-to-wafer stacking

Date

2016
Proceedings Paper
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dc.contributor.authorInoue, Fumihiro
dc.contributor.authorJourdain, Anne
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorPeng, Lan
dc.contributor.authorLiebens, Maarten
dc.contributor.authorArmini, Silvia
dc.contributor.authorUedono, Akira
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorSleeckx, Erik
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorLiebens, Maarten
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.date.accessioned2021-10-23T11:27:51Z
dc.date.available2021-10-23T11:27:51Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26765
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7545713/?arnumber=7545713
dc.source.beginpage2095
dc.source.conferenceIEEE 66th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2016
dc.source.conferencelocationLas Vegas, NV USA
dc.source.endpage2102
dc.title

Characterization of extreme Si thinning proces for wafer-to-wafer stacking

dc.typeProceedings paper
dspace.entity.typePublication
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