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Characterization of extreme Si thinning proces for wafer-to-wafer stacking
Publication:
Characterization of extreme Si thinning proces for wafer-to-wafer stacking
Date
2016
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Inoue, Fumihiro
;
Jourdain, Anne
;
De Vos, Joeri
;
Peng, Lan
;
Liebens, Maarten
;
Armini, Silvia
;
Uedono, Akira
;
Rebibis, Kenneth June
;
Miller, Andy
;
Beyne, Eric
;
Sleeckx, Erik
Journal
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2058
since deposited on 2021-10-23
Acq. date: 2025-10-27
Citations
Metrics
Views
2058
since deposited on 2021-10-23
Acq. date: 2025-10-27
Citations