Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Conference contributions
Characterization of extreme Si thinning proces for wafer-to-wafer stacking
Publication:
Characterization of extreme Si thinning proces for wafer-to-wafer stacking
Copy permalink
Date
2016
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Inoue, Fumihiro
;
Jourdain, Anne
;
De Vos, Joeri
;
Peng, Lan
;
Liebens, Maarten
;
Armini, Silvia
;
Uedono, Akira
;
Rebibis, Kenneth June
;
Miller, Andy
;
Beyne, Eric
;
Sleeckx, Erik
Journal
Abstract
Description
Metrics
Views
2061
since deposited on 2021-10-23
1
last month
Acq. date: 2025-12-12
Citations
Metrics
Views
2061
since deposited on 2021-10-23
1
last month
Acq. date: 2025-12-12
Citations