Cu-Cu insertion bonding technique using photosensitive polymer as WLUF

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Authors
Potoms, Goedele; Wang, Teng; Derakhshandeh, Jaber; Daily, Robert; Capuz, Giovanni; Gonzalez, Mario; Beyer, Gerald; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric
Conference
16th IEEE Electronic Packaging Technology Conference - EPTC
Title
Cu-Cu insertion bonding technique using photosensitive polymer as WLUF
Publication type
Proceedings paper
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