Publication:

Cu-Cu insertion bonding technique using photosensitive polymer as WLUF

Date

2014
Proceedings Paper
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dc.contributor.authorPotoms, Goedele
dc.contributor.authorWang, Teng
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorDaily, Robert
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorGonzalez, Mario
dc.contributor.authorBeyer, Gerald
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorPotoms, Goedele
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T04:50:17Z
dc.date.available2021-10-22T04:50:17Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24397
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7028331
dc.source.beginpage313
dc.source.conference16th IEEE Electronic Packaging Technology Conference - EPTC
dc.source.conferencedate3/12/2014
dc.source.conferencelocationMarina Bay Sands Singapore
dc.source.endpage317
dc.title

Cu-Cu insertion bonding technique using photosensitive polymer as WLUF

dc.typeProceedings paper
dspace.entity.typePublication
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