Challenges and solutions on pre-assembly processes for thinned 3D wafers with micro-bumps on the backside

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Author(s)

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Demeurisse, Caroline

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Rebibis, Kenneth June

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Phommahaxay, Alain

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Capuz, Giovanni

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Struyf, Herbert

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1966 since deposited on 2021-10-22

Acq. date: 2025-10-27