Authors

Podpod, Arnita; Demeurisse, Caroline; Rebibis, Kenneth June; Gerets, Carine; Phommahaxay, Alain; Capuz, Giovanni; Duval, Fabrice; Sleeckx, Erik; Struyf, Herbert; Miller, Andy; Beyne, Eric; Beyer, Gerald

Conference

16th IEEE Electronic Packaging Technology Conference - EPTC

Title

Challenges and solutions on pre-assembly processes for thinned 3D wafers with micro-bumps on the backside

Publication type

Proceedings paper

Embargo date

9999-12-31