Publication:

Challenges and solutions on pre-assembly processes for thinned 3D wafers with micro-bumps on the backside

Date

2014
Proceedings Paper
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dc.contributor.authorPodpod, Arnita
dc.contributor.authorDemeurisse, Caroline
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorGerets, Carine
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorDuval, Fabrice
dc.contributor.authorSleeckx, Erik
dc.contributor.authorStruyf, Herbert
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorBeyer, Gerald
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorDemeurisse, Caroline
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T04:48:18Z
dc.date.available2021-10-22T04:48:18Z
dc.date.embargo9999-12-31
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24393
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7028283
dc.source.beginpage75
dc.source.conference16th IEEE Electronic Packaging Technology Conference - EPTC
dc.source.conferencedate3/12/2014
dc.source.conferencelocationSingapore Singapore
dc.source.endpage79
dc.title

Challenges and solutions on pre-assembly processes for thinned 3D wafers with micro-bumps on the backside

dc.typeProceedings paper
dspace.entity.typePublication
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