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A highly reliable 1×5μm via-last TSV module
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Authors
Van Huylenbroeck, Stefaan
;
Li, Yunlong
;
De Vos, Joeri
;
Jamieson, Geraldine
;
Tutunjyan, Nina
;
Miller, Andy
;
Beyer, Gerald
;
Beyne, Eric
Conference
IEEE International Interconnect Technology Conference - IITC
Title
A highly reliable 1×5μm via-last TSV module
Publication type
Proceedings paper
Embargo date
9999-12-31
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