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A highly reliable 1×5μm via-last TSV module
Publication:
A highly reliable 1×5μm via-last TSV module
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Date
2018
Proceedings Paper
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38302.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Van Huylenbroeck, Stefaan
;
Li, Yunlong
;
De Vos, Joeri
;
Jamieson, Geraldine
;
Tutunjyan, Nina
;
Miller, Andy
;
Beyer, Gerald
;
Beyne, Eric
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2
since deposited on 2021-10-26
Acq. date: 2025-12-12
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1997
since deposited on 2021-10-26
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last month
Acq. date: 2025-12-12
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Downloads
2
since deposited on 2021-10-26
Acq. date: 2025-12-12
Views
1997
since deposited on 2021-10-26
2
last month
Acq. date: 2025-12-12
Citations