Publication:

A highly reliable 1×5μm via-last TSV module

Date

2018
Proceedings Paper
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dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorLi, Yunlong
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorTutunjyan, Nina
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorTutunjyan, Nina
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.date.accessioned2021-10-26T07:04:10Z
dc.date.available2021-10-26T07:04:10Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32070
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8430389/
dc.source.beginpage94
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate4/06/2018
dc.source.conferencelocationSanta Clara, CA USA
dc.source.endpage96
dc.title

A highly reliable 1×5μm via-last TSV module

dc.typeProceedings paper
dspace.entity.typePublication
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