Publication:

Advances in SiCN-SiCN bonding with high accuracy wafer-to-wafer (W2W) stacking technology

Date

2018

Proceedings Paper

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Files

38153.pdf 831.76 KB

Author(s)

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Inoue, Fumihiro

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Phommahaxay, Alain

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Zinner, Dominik

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Wagenleitner, Thomas

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Uhrmann, Thomas

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Wimplinger, Markus

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Schoenaers, Ben

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Stesmans, Andre

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Afanasiev, Valeri

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Acq. date: 2026-01-25