Publication:

Advances in SiCN-SiCN bonding with high accuracy wafer-to-wafer (W2W) stacking technology

Date

2018

Proceedings Paper

Simple item page Full metadata Statistics

Files

38153.pdf 831.76 KB

Author(s)

;

;

;

Inoue, Fumihiro

;

Phommahaxay, Alain

;

;

;

Zinner, Dominik

;

Wagenleitner, Thomas

;

Uhrmann, Thomas

;

Wimplinger, Markus

;

Schoenaers, Ben

;

Stesmans, Andre

;

Afanasiev, Valeri

;

;

;

Statistics

2133 since deposited on 2021-10-26

7last month

1last week

Acq. date: 2026-10-13