Publication:

Advances in SiCN-SiCN bonding with high accuracy wafer-to-wafer (W2W) stacking technology

Date

2018
Proceedings Paper
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dc.contributor.authorPeng, Lan
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorIacovo, Serena
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorSleeckx, Erik
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorZinner, Dominik
dc.contributor.authorWagenleitner, Thomas
dc.contributor.authorUhrmann, Thomas
dc.contributor.authorWimplinger, Markus
dc.contributor.authorSchoenaers, Ben
dc.contributor.authorStesmans, Andre
dc.contributor.authorAfanasiev, Valeri
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorAfanasiev, Valeri
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-26T00:59:17Z
dc.date.available2021-10-26T00:59:17Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31505
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8429664
dc.source.beginpage985
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate4/06/2018
dc.source.conferencelocationSanta Clara, CA USA
dc.source.endpage992
dc.title

Advances in SiCN-SiCN bonding with high accuracy wafer-to-wafer (W2W) stacking technology

dc.typeProceedings paper
dspace.entity.typePublication
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