A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps

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Authors
Derakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas; Bex, Pieter; Jamieson, Geraldine; Maehara, Masataka; Shafahian, Ehsan; Bertheau, Julien; Beyne, Eric; La Tulipe, Douglas Charles; Beyer, Gerald; Van der Plas, Geert; Miller, Andy
DOI
10.1109/ECTC32696.2021.00183
EISBN
978-0-7381-4523-5
ISSN
0569-5503
Conference
IEEE 71st Electronic Components and Technology Conference (ECTC)
Journal
na
Title
A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
Publication type
Proceedings paper
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