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A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
Publication:
A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
Date
2021
Proceedings Paper
https://doi.org/10.1109/ECTC32696.2021.00183
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Derakhshandeh, Jaber
;
Gerets, Carine
;
Inoue, Fumihiro
;
Capuz, Giovanni
;
Cherman, Vladimir
;
Lofrano, Melina
;
Hou, Lin
;
Cochet, Tom
;
De Preter, Inge
;
Webers, Tomas
;
Bex, Pieter
;
Jamieson, Geraldine
;
Maehara, Masataka
;
Shafahian, Ehsan
;
Bertheau, Julien
;
Beyne, Eric
;
La Tulipe, Douglas Charles
;
Beyer, Gerald
;
Van der Plas, Geert
;
Miller, Andy
Journal
na
Abstract
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1964
since deposited on 2022-03-16
Acq. date: 2025-10-27
Citations
Metrics
Views
1964
since deposited on 2022-03-16
Acq. date: 2025-10-27
Citations