Authors

Inoue, Fumihiro; Phommahaxay, Alain; Podpod, Arnita; Suhard, Samuel; Hoshino, Hitoshi; Berthold, Moeller; Sleeckx, Erik; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric

Conference

2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

Title

Advanced dicing technologies for combination of wafer to wafer and collective die to wafer fusion bonding

Publication type

Proceedings paper

Embargo date

9999-12-31