Publication:

Advanced dicing technologies for combination of wafer to wafer and collective die to wafer fusion bonding

Date

2019
Proceedings Paper
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dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorPodpod, Arnita
dc.contributor.authorSuhard, Samuel
dc.contributor.authorHoshino, Hitoshi
dc.contributor.authorBerthold, Moeller
dc.contributor.authorSleeckx, Erik
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-27T10:45:18Z
dc.date.available2021-10-27T10:45:18Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33197
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8811039
dc.source.beginpage437
dc.source.conference2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedate28/05/2018
dc.source.conferencelocationLas Vegas, NV USA
dc.title

Advanced dicing technologies for combination of wafer to wafer and collective die to wafer fusion bonding

dc.typeProceedings paper
dspace.entity.typePublication
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