3D stacking of Co and Ni based microbumps

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Authors
De Preter, Inge; Derakhshandeh, Jaber; Hou, Lin; Gerets, Carine; Wang, Teng; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric
Conference
Electronics System-Integration Technology Conference - ESTC
Title
3D stacking of Co and Ni based microbumps
Publication type
Proceedings paper
Embargo date
9999-12-31
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