Browsing by author "Bex, Pieter"

10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

Derakhshandeh, Jaber; Capuz, Giovanni; Cherman, Vladimir; Inoue, Fumihiro; De Preter, Inge; Hou, Lin; Bex, Pieter; Gerets, Carine; Duval, Fabrice; Webers, Tomas; Bertheau, Julien; Van Huylenbroeck, Stefaan; Phommahaxay, Alain; Shafahian, Ehsan; Van der Plas, Geert; Beyne, Eric; Miller, Andy; Beyer, Gerald (2020)

3D Heterogeneous Package Integration of Air/Magnetic Core Inductor: 89%-Efficiency Buck Converter with Backside Power Delivery Network

Sun, Xiao; Lin, Hesheng; Velenis, Dimitrios; Slabbekoorn, John; Talmelli, Giacomo; Bex, Pieter; Sterken, Tom; Lauwereins, Rudy; Adelmann, Christoph; Miller, Andy; Van der Plas, Geert; Beyne, Eric (2020)

3D IC assembly using thermal compression bonding and wafer-level underfill – strategies for quality improvement and throughput enhancement

Wang, Teng; Bex, Pieter; Capuz, Giovanni; Duval, Fabrice; Inoue, Fumihiro; Gerets, Carine; Bertheau, Julien; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Natsukawa, Masanori; Mitsukura, Kazuyuki; Hatakeyama, Keiichi (2016)

3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly

Daily, Robert; Capuz, Giovanni; Wang, Teng; Bex, Pieter; Struyf, Herbert; Sleeckx, Erik; Demeurisse, Caroline; Attard, A.; Eberharter, W.; Klingler, H. (2015)

3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures

De Preter, Inge; Derakhshandeh, Jaber; Nagano, Fuya; Houshmand Sharifi, Shamin; Hou, Lin; Bex, Pieter; Suhard, Samuel; Shibata, Toshiaki; Yukinori, Oda; Hashimoto, Shigeo; Lieten, Ruben; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2017)

A high-bandwidth fine-pitch 2.57Tbps/mm in-package communication link achieving 48fJ/bit/mm efficiency

Pantano, Nicolas; Van der Plas, Geert; Bex, Pieter; Nolmans, Philip; Velenis, Dimitrios; Verhelst, Marian; Beyne, Eric (2019)

A novel in-situ resistance measurement to extract IMC resistivity and kinetic parameter for CoSn 3D stacks

Hou, Lin; Derakhshandeh, Jaber; De Coster, Jeroen; Wang, Teng; Cherman, Vladimir; Bex, Pieter; Van De Plas, Geert; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid (2017)

A novel method for characterization of Ultra Low Viscosity NCF layers using TCB for 3D Assembly

Capuz, Giovanni; Lofrano, Melina; Gerets, Carine; Duval, Fabrice; Bex, Pieter; Derakhshandeh, Jaber; Phommahaxay, Alain; Beyne, Eric; Miller, Andy; Vanstreels, Kris (2020)

A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage

Iacovo, Serena; D'have, Koen; Okudur, Oguzhan Orkut; De Vos, Joeri; Uhrmann, Thomas; Plach, Thomas; Conard, Thierry; Meersschaut, Johan; Bex, Pieter; Brems, Steven; Phommahaxay, Alain; Gonzalez, Mario; Witters, Liesbeth; Beyer, Gerald; Beyne, Eric (2023)

A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps

Derakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas; Bex, Pieter; Jamieson, Geraldine; Maehara, Masataka; Shafahian, Ehsan; Bertheau, Julien; Beyne, Eric; La Tulipe, Douglas Charles; Beyer, Gerald; Van der Plas, Geert; Miller, Andy (2021)

A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP

Phommahaxay, Alain; Nakamura, Atsushi; Potoms, Goedele; Bertheau, Julien; Bex, Pieter; Duval, Fabrice; Podpod, Arnita; Verbinnen, Greet; Kamochi, Yoshitaka; Sawano, Mitsuru; Beyer, Gerald; Sleeckx, Erik; Beyne, Eric (2017)

Advances in temporary carrier technology for high density fan-out device build-up

Podpod, Arnita; Phommahaxay, Alain; Bex, Pieter; Slabbekoorn, John; Bertheau, Julien; Salahouelhadj, Abdellah; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric; Guerrero, Alice; Yess, Kim; Arnold, Kim (2019)

An in-situ resistance measurement to extract IMC resistivity and kinetic parameter of alternative metallurgies for 3D stacking

Hou, Lin; Derakhshandeh, Jaber; Radisic, Alex; Honore, Mia; De Coster, Jeroen; Cherman, Vladimir; Bex, Pieter; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Rebibis, Kenneth June (2018)

Backside power delivery with a direct 14:1/19:1 high-ratio point-of-load power converter for servers and datacenters

Lin, Hesheng; Hiblot, Gaspard; Sun, Xiao; Talmelli, Giacomo; Velenis, Dimitrios; Bex, Pieter; Adelmann, Christoph; Lauwereins, Rudy; Catthoor, Francky; Van der Plas, Geert; Beyne, Eric (2021)

Carrier Systems for Collective Die-to-Wafer Bonding

Kennes, Koen; Phommahaxay, Alain; Guerrero, Alice; Suhard, Samuel; Bex, Pieter; Brems, Steven; Liu, Xiao; Tussing, Sebastian; Beyer, Gerald; Beyne, Eric (2022)

Comparing SAM (Self-Assembled Monolayer) deposition methods to passivate copper microbumps for 3D stacking

Houshmand Sharifi, Shamin; Derakhshandeh, Jaber; Armini, Silvia; De Preter, Inge; Bex, Pieter; Hou, Lin; Bartha, Johan W; Neumann, Volker; Herregods, Sebastiaan; Nagano, Fuya; Rebibis, Kenneth June; Miller, Andy; De Wolf, Ingrid; Beyer, Gerald; Beyne, Eric (2017)

Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G

Sun, Xiao; Slabbekoorn, John; Sinha, Siddhartha; Bex, Pieter; Pinho, Nelson; Webers, Tomas; Velenis, Dimitrios; Miller, Andy; Collaert, Nadine; Van der Plas, Geert; Beyne, Eric (2022)