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Carrier Systems for Collective Die-to-Wafer Bonding
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Authors
Kennes, Koen
;
Phommahaxay, Alain
;
Guerrero, Alice
;
Suhard, Samuel
;
Bex, Pieter
;
Brems, Steven
;
Liu, Xiao
;
Tussing, Sebastian
;
Beyer, Gerald
;
Beyne, Eric
DOI
10.1109/ECTC51906.2022.00324
EISBN
978-1-6654-7943-1
ISSN
0569-5503
Conference
72nd IEEE Electronic Components and Technology Conference (ECTC)
Journal
na
Title
Carrier Systems for Collective Die-to-Wafer Bonding
Publication type
Proceedings paper
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Date
Summary
2
20.500.12860/40445.2
*
2022-11-21T09:56:11Z
validation by library/open access desk
1
20.500.12860/40445
2022-09-17T02:52:10Z
*Selected version
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