Browsing by author "Beyer, Gerald"
Now showing items 1-20 of 359
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10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process
Derakhshandeh, Jaber; Capuz, Giovanni; Cherman, Vladimir; Inoue, Fumihiro; De Preter, Inge; Hou, Lin; Bex, Pieter; Gerets, Carine; Duval, Fabrice; Webers, Tomas; Bertheau, Julien; Van Huylenbroeck, Stefaan; Phommahaxay, Alain; Shafahian, Ehsan; Van der Plas, Geert; Beyne, Eric; Miller, Andy; Beyer, Gerald (2020) -
3D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumps
Guo, Wei; Van der Plas, Geert; Ivankovic, Andrej; Eneman, Geert; Cherman, Vladimir; De Wachter, Bart; Mercha, Abdelkarim; Gonzalez, Mario; Civale, Yann; Redolfi, Augusto; Buisson, Thibault; Jourdain, Anne; Vandevelde, Bart; Rebibis, Kenneth June; De Wolf, Ingrid; La Manna, Antonio; Beyer, Gerald; Beyne, Eric; Swinnen, Bart (2012) -
3D Heterogeneous integration - High density FOWLP and lithography
Miller, Andy; Beyer, Gerald (2018) -
3D IC assembly using thermal compression bonding and wafer-level underfill – strategies for quality improvement and throughput enhancement
Wang, Teng; Bex, Pieter; Capuz, Giovanni; Duval, Fabrice; Inoue, Fumihiro; Gerets, Carine; Bertheau, Julien; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Natsukawa, Masanori; Mitsukura, Kazuyuki; Hatakeyama, Keiichi (2016) -
3D integration challenges for fine pitch back side micro-bumping on ZoneBOND™ wafers
Buisson, Thibault; De Preter, Inge; Suhard, Samuel; Vandersmissen, Kevin; Jaenen, Patrick; Witters, Thomas; Jamieson, Geraldine; Jourdain, Anne; Van Huylenbroeck, Stefaan; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2012) -
3D SoC integration, beyond 2.5D chiplets
Beyne, Eric; Milojevic, Dragomir; Van der Plas, Geert; Beyer, Gerald (2021) -
3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures
De Preter, Inge; Derakhshandeh, Jaber; Nagano, Fuya; Houshmand Sharifi, Shamin; Hou, Lin; Bex, Pieter; Suhard, Samuel; Shibata, Toshiaki; Yukinori, Oda; Hashimoto, Shigeo; Lieten, Ruben; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2017) -
3D stacking induced mechanical stress effects
Cherman, Vladimir; Van der Plas, Geert; De Vos, Joeri; Ivankovic, Andrej; Lofrano, Melina; Simons, Veerle; Gonzalez, Mario; Vanstreels, Kris; Wang, Teng; Daily, Robert; Guo, Wei; Beyer, Gerald; La Manna, Antonio; De Wolf, Ingrid; Beyne, Eric (2014) -
3D stacking of Co and Ni based microbumps
De Preter, Inge; Derakhshandeh, Jaber; Hou, Lin; Gerets, Carine; Wang, Teng; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
3D stacking using bump-less process for sub 10μm pitches
Derakhshandeh, Jaber; De Preter, Inge; Gerets, Carine; Hou, Lin; Heylen, Nancy; Beyne, Eric; Beyer, Gerald; Slabbekoorn, John; Dubey, Vikas; Jourdain, Anne; Potoms, Goedele; Inoue, Fumihiro; Jamieson, Geraldine; Vandersmissen, Kevin; Suhard, Samuel; Webers, Tomas; Capuz, Giovanni; Wang, Teng; Rebibis, Kenneth June; Miller, Andy (2016) -
3D stacking using Cu-Cu direct bonding
Hu, Yu-Hsiang; Liu, C.S.; Lii, M.J.; Rebibis, Kenneth June; Jourdain, Anne; La Manna, Antonio; Beyer, Gerald; Beyne, Eric; Yu, (2012-02) -
3D-SoC integration utilizing high accuracy wafer level bonding
Peng, Lan; Kim, Soon-Wook; Heylen, Nancy; Reichardt, Maik; Kurz, Florian; Wagenleitner, Thomas; Sleeckx, Erik; Struyf, Herbert; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
A feasibility study of dual damascene porous SiLK resin with spin-on hard masks
Hoofman, Romano; Michelon, Julien; Verheijden, G.J.A.M.; Waeterloos, Joost; Caluwaerts, Rudy; Schmidt, M.O.; Demeurisse, Caroline; Vandeweyer, Tom; Demuynck, Steven; Tokei, Zsolt; Beyer, Gerald (2004) -
A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film
Travaly, Youssef; Tsutsue, M.; Ikeda, Atsushi; Verdonck, Patrick; Tokei, Zsolt; Willegems, Myriam; Van Aelst, Joke; Struyf, Herbert; Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Claes, Martine; Heylen, Nancy; Sinapi, Fabrice; Richard, Olivier; De Roest, David; Kaneko, S; Kemeling, N; Fukazawa, A; Matsuki, N; Matsushita, K; Tsuji, N; Kagami, K; Sprey, Hessel; Beyer, Gerald (2007) -
A highly reliable 1.4μm pitch via-last TSV module for wafer-to-wafer hybrid bonded 3D-SOC systems
Van Huylenbroeck, Stefaan; De Vos, Joeri; El-Mekki, Zaid; Jamieson, Geraldine; Tutunjyan, Nina; Muga, Karthik; Stucchi, Michele; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
A highly reliable 1×5μm via-last TSV module
Van Huylenbroeck, Stefaan; Li, Yunlong; De Vos, Joeri; Jamieson, Geraldine; Tutunjyan, Nina; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018) -
A NEMS based sensor to monitor stress in deep sub-micron Cu/Low-$k$ interconnects
Wilson, Chris; Croes, Kristof; Van Cauwenberghe, Marc; Tokei, Zsolt; Beyer, Gerald; Horsfall, Alton; O'Neill, Anthony (2009) -
A new perspective of barrier material evaluation and process optimization
Zhao, Larry; Tokei, Zsolt; Gianni, Giai Gischia; Volders, Henny; Beyer, Gerald (2009) -
A novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-μm pitch
Podpod, Arnita; Slabbekoorn, John; Phommahaxay, Alain; Duval, Fabrice; Salahouelhadj, Abdellah; Gonzalez, Mario; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018) -
A novel in-situ resistance measurement to extract IMC resistivity and kinetic parameter for CoSn 3D stacks
Hou, Lin; Derakhshandeh, Jaber; De Coster, Jeroen; Wang, Teng; Cherman, Vladimir; Bex, Pieter; Van De Plas, Geert; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid (2017)