A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film

Thumbnail
View/open
Metadata
Show full item record
Authors
Travaly, Youssef; Tsutsue, M.; Ikeda, Atsushi; Verdonck, Patrick; Tokei, Zsolt; Willegems, Myriam; Van Aelst, Joke; Struyf, Herbert; Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Claes, Martine; Heylen, Nancy; Sinapi, Fabrice; Richard, Olivier; De Roest, David; Kaneko, S; Kemeling, N; Fukazawa, A; Matsuki, N; Matsushita, K; Tsuji, N; Kagami, K; Sprey, Hessel; Beyer, Gerald
Conference
Advanced Metallization Conference: 17th Asian Session
Title
A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film
Publication type
Oral presentation
Embargo date
9999-12-31
Collections