Publication:

A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film

Date

2007
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Author(s)

Travaly, Youssef
;
Tsutsue, M.
;
Ikeda, Atsushi
;
Verdonck, Patrick  
;
Tokei, Zsolt  
;
Willegems, Myriam  
;
Van Aelst, Joke  
;
Struyf, Herbert  
;
Vereecke, Guy  
;
Kesters, Els  
;
Le, Quoc Toan  
;
Claes, Martine  
;
Heylen, Nancy  
;
Sinapi, Fabrice
;
Richard, Olivier  
;
De Roest, David  
;
Kaneko, S
;
Kemeling, N
;
Fukazawa, A
;
Matsuki, N
;
Matsushita, K
;
Tsuji, N
;
Kagami, K
;
Sprey, Hessel  
;
Beyer, Gerald  

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1989 since deposited on 2021-10-16
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Acq. date: 2025-12-08

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