Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Presentations
A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film
Publication:
A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film
Copy permalink
Date
2007
Presentation
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
16216.pdf
324.69 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Travaly, Youssef
;
Tsutsue, M.
;
Ikeda, Atsushi
;
Verdonck, Patrick
;
Tokei, Zsolt
;
Willegems, Myriam
;
Van Aelst, Joke
;
Struyf, Herbert
;
Vereecke, Guy
;
Kesters, Els
;
Le, Quoc Toan
;
Claes, Martine
;
Heylen, Nancy
;
Sinapi, Fabrice
;
Richard, Olivier
;
De Roest, David
;
Kaneko, S
;
Kemeling, N
;
Fukazawa, A
;
Matsuki, N
;
Matsushita, K
;
Tsuji, N
;
Kagami, K
;
Sprey, Hessel
;
Beyer, Gerald
Journal
Abstract
Description
Statistics
Views
1990
since deposited on 2021-10-16
1
last month
Acq. date: 2026-02-28
Citations
Statistics
Views
1990
since deposited on 2021-10-16
1
last month
Acq. date: 2026-02-28
Citations