Publication:

3D stacking using Cu-Cu direct bonding

Date

2012-02

Proceedings Paper

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Files

24875.pdf 307.72 KB

Author(s)

Hu, Yu-Hsiang

;

Liu, C.S.

;

Lii, M.J.

;

Rebibis, Kenneth June

;

Jourdain, Anne

;

La Manna, Antonio

;

;

;

Yu,

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2034 since deposited on 2021-10-20

Acq. date: 2026-06-14