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Conference contributions
3D stacking using Cu-Cu direct bonding
Publication:
3D stacking using Cu-Cu direct bonding
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Date
2012-02
Proceedings Paper
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24875.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Hu, Yu-Hsiang
;
Liu, C.S.
;
Lii, M.J.
;
Rebibis, Kenneth June
;
Jourdain, Anne
;
La Manna, Antonio
;
Beyer, Gerald
;
Beyne, Eric
;
Yu,
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Acq. date: 2025-12-11
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2031
since deposited on 2021-10-20
1
last month
Acq. date: 2025-12-11
Citations