Publication:

3D stacking using Cu-Cu direct bonding

Date

2012-02
Proceedings Paper
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dc.contributor.authorHu, Yu-Hsiang
dc.contributor.authorLiu, C.S.
dc.contributor.authorLii, M.J.
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorJourdain, Anne
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorYu,
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-20T11:42:28Z
dc.date.available2021-10-20T11:42:28Z
dc.date.embargo9999-12-31
dc.date.issued2012-02
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20829
dc.source.beginpage1-Mar
dc.source.conferenceIEEE International 3D System Integration Conference - 3DIC
dc.source.conferencedate31/01/2012
dc.source.conferencelocationOsaka Japan
dc.title

3D stacking using Cu-Cu direct bonding

dc.typeProceedings paper
dspace.entity.typePublication
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