Authors

Guo, Wei; Van der Plas, Geert; Ivankovic, Andrej; Eneman, Geert; Cherman, Vladimir; De Wachter, Bart; Mercha, Abdelkarim; Gonzalez, Mario; Civale, Yann; Redolfi, Augusto; Buisson, Thibault; Jourdain, Anne; Vandevelde, Bart; Rebibis, Kenneth June; De Wolf, Ingrid; La Manna, Antonio; Beyer, Gerald; Beyne, Eric; Swinnen, Bart

Conference

IEEE International Conference on IC Design and technology - ICICDT

Title

3D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumps

Publication type

Proceedings paper

Embargo date

9999-12-31