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3D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumps
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1 since deposited on 2021-10-20
Acq. date: 2026-01-06
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Acq. date: 2026-01-06
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1 since deposited on 2021-10-20
Acq. date: 2026-01-06
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2048 since deposited on 2021-10-20
3last month
2last week
Acq. date: 2026-01-06
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