Browsing by author "Beyer, Gerald"
Now showing items 21-40 of 359
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A novel intermetallic compound insertion bonding to improve throughput for 3D die to wafer stacking
Hou, Lin; Derakhshandeh, Jaber; Capuz, Giovanni; Lofrano, Melina; Beyne, Eric; Miller, Andy; Beyer, Gerald; De Wolf, Ingrid (2020) -
A novel test structure to study intrinsic reliability of barrier/low-k
Zhao, Larry; Tokei, Zsolt; Gianni, Giai Gischia; Pantouvaki, Marianna; Croes, Kristof; Beyer, Gerald (2009) -
A study of growth mechanism of TiN and WCN barrier films deposited by atomic layer deposition on different substrates
Satta, Alessandra; Schuhmacher, Jörg; Whelan, Caroline; Vandervorst, Wilfried; Brongersma, Sywert; Beyer, Gerald; Brijs, Bert; Conard, Thierry; Maex, Karen; Vantomme, Andre; Viitanen, M.M.; Brongersma, H.H. (2002) -
A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage
Iacovo, Serena; D'have, Koen; Okudur, Oguzhan Orkut; De Vos, Joeri; Uhrmann, Thomas; Plach, Thomas; Conard, Thierry; Meersschaut, Johan; Bex, Pieter; Brems, Steven; Phommahaxay, Alain; Gonzalez, Mario; Witters, Liesbeth; Beyer, Gerald; Beyne, Eric (2023) -
A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
Derakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas; Bex, Pieter; Jamieson, Geraldine; Maehara, Masataka; Shafahian, Ehsan; Bertheau, Julien; Beyne, Eric; La Tulipe, Douglas Charles; Beyer, Gerald; Van der Plas, Geert; Miller, Andy (2021) -
A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP
Phommahaxay, Alain; Nakamura, Atsushi; Potoms, Goedele; Bertheau, Julien; Bex, Pieter; Duval, Fabrice; Podpod, Arnita; Verbinnen, Greet; Kamochi, Yoshitaka; Sawano, Mitsuru; Beyer, Gerald; Sleeckx, Erik; Beyne, Eric (2017) -
Acoustic modulation during laser debonding of collective hybrid bonded dies
Kennes, Koen; Phommahaxay, Alain; Guerrero, Alice; Bumueller, Dennis; Suhard, Samuel; Bex, Pieter; Tussing, Sebastian; Liu, Xiao; Beyer, Gerald; Beyne, Eric (2021) -
Advanced capabilities and applications of a sputter-RBS system
Brijs, Bert; Deleu, Jeroen; Beyer, Gerald; Vandervorst, Wilfried (1999) -
Advanced capabilities and applications of a sputter-RBS system
Brijs, Bert; Deleu, Jeroen; Beyer, Gerald; Vandervorst, Wilfried (1998) -
Advanced metallization scheme for 3×50μm via middle TSV and beyond
Van Huylenbroeck, Stefaan; Li, Yunlong; Heylen, Nancy; Croes, Kristof; Beyer, Gerald; Beyne, Eric; Brouri, Mohand; Gopinath, Sanjay; Nalla, Praveen; Thorum, Matthew; Meshram, Prashant; Anjos, Daniela M.; Yu, Jengyi (2015) -
Advanced organic polymers for the aggressive scaling of low-k materials
Pantouvaki, Marianna; Huffman, Craig; Zhao, Larry; Heylen, Nancy; Ono, Y; Nakajima, M; Nakatani, K; Beyer, Gerald; Baklanov, Mikhaïl (2011) -
Advanced organic polymers for the aggressive scaling of low-k materials
Pantouvaki, Marianna; Zhao, Larry; Huffman, Craig; Heylen, Nancy; Ono, Yukiharu; Nakajima, Michio; Nakatani, Koji; Beyer, Gerald; Baklanov, Mikhaïl (2010) -
Advanced solutions for copper and low k technology
Beyer, Gerald; Baklanov, Mikhaïl; Brongersma, Sywert; De Roest, David; Donaton, R.; Grillaert, Joost; Lanckmans, Filip; Maenhoudt, Mireille; Maex, Karen; Richard, Emmanuel; Struyf, Herbert; Stucchi, Michele; Tokei, Zsolt; Van Hove, Marleen; Vervoort, Iwan (2000) -
Advances in SiCN-SiCN bonding with high accuracy wafer-to-wafer (W2W) stacking technology
Peng, Lan; Kim, Soon-Wook; Iacovo, Serena; Inoue, Fumihiro; Phommahaxay, Alain; Sleeckx, Erik; De Vos, Joeri; Zinner, Dominik; Thomas, Wagenleitner; Thomas, Uhrmann; Markus, Wimplinger; Ben, Schoenaers; Andre, Stesmans; Afanasiev, Valeri; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018) -
Advances in temporary carrier technology for high density fan-out device build-up
Podpod, Arnita; Phommahaxay, Alain; Bex, Pieter; Slabbekoorn, John; Bertheau, Julien; Salahouelhadj, Abdellah; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric; Guerrero, Alice; Yess, Kim; Arnold, Kim (2019) -
Advances in thin wafer debonding and ultra thin 28nm FinFET substrate transfer
Phommahaxay, Alain; Guerrero, Alice; Jourdain, Anne; Potoms, Goedele; Verbinnen, Greet; Bai, Dongshun; Yess, Kim; Arnold, Kim; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric (2017) -
Aggressive scaling of Cu lowk: impact on metrology
Maex, Karen; Brongersma, Sywert; Iacopi, Francesca; Vanstreels, Kris; Travaly, Youssef; Baklanov, Mikhaïl; D'Haen, Jan; Beyer, Gerald (2005) -
Air-gap formation by UV-assisted decomposition of CVD material
Pantouvaki, Marianna; Humbert, Aurelie; Van Besien, Els; Camerotto, Elisabeth; Travaly, Youssef; Richard, Olivier; Willegems, Myriam; Volders, Henny; Kellens, Kristof; Daamen, Roel; Hoofman, Romano; Beyer, Gerald (2008) -
Air-gap formation by UV-assisted decomposition of CVD material
Pantouvaki, Marianna; Humbert, Aurelie; Van Besien, Els; Camerotto, Elisabeth; Travaly, Youssef; Richard, Olivier; Willegems, Myriam; Volders, Henny; Kellens, Kristof; Daamen, Roel; Hoofman, Romano; Beyer, Gerald (2008) -
Airgaps for interconnects: Ready to go?
Beyer, Gerald; Pantouvaki, Marianna; Tokei, Zsolt (2010)