Advances in thin wafer debonding and ultra thin 28nm FinFET substrate transfer

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Authors
Phommahaxay, Alain; Guerrero, Alice; Jourdain, Anne; Potoms, Goedele; Verbinnen, Greet; Bai, Dongshun; Yess, Kim; Arnold, Kim; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric
Conference
IEEE 67th Electronic Components and Technology Conference - ECTC
Title
Advances in thin wafer debonding and ultra thin 28nm FinFET substrate transfer
Publication type
Meeting abstract
Embargo date
9999-12-31
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