Publication:

Advances in thin wafer debonding and ultra thin 28nm FinFET substrate transfer

Date

2017
Meeting abstract
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dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorGuerrero, Alice
dc.contributor.authorJourdain, Anne
dc.contributor.authorPotoms, Goedele
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorBai, Dongshun
dc.contributor.authorYess, Kim
dc.contributor.authorArnold, Kim
dc.contributor.authorSleeckx, Erik
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorGuerrero, Alice
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorPotoms, Goedele
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-24T11:00:21Z
dc.date.available2021-10-24T11:00:21Z
dc.date.embargo9999-12-31
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29174
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7999771/
dc.source.beginpage740
dc.source.conferenceIEEE 67th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate30/05/2017
dc.source.conferencelocationOrlando, FL USA
dc.source.endpage745
dc.title

Advances in thin wafer debonding and ultra thin 28nm FinFET substrate transfer

dc.typeMeeting abstract
dspace.entity.typePublication
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