JavaScript is disabled for your browser. Some features of this site may not work without it.
A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP
Electronic Components and Technology Conference - ECTC
Title
A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP