Publication:

A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP

Date

2017
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dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorNakamura, Atsushi
dc.contributor.authorPotoms, Goedele
dc.contributor.authorBertheau, Julien
dc.contributor.authorBex, Pieter
dc.contributor.authorDuval, Fabrice
dc.contributor.authorPodpod, Arnita
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorKamochi, Yoshitaka
dc.contributor.authorSawano, Mitsuru
dc.contributor.authorBeyer, Gerald
dc.contributor.authorSleeckx, Erik
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorPotoms, Goedele
dc.contributor.imecauthorBertheau, Julien
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-24T11:01:00Z
dc.date.available2021-10-24T11:01:00Z
dc.date.embargo9999-12-31
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29175
dc.source.conferenceElectronic Components and Technology Conference - ECTC
dc.source.conferencedate30/05/2017
dc.source.conferencelocationOrlando, FL USA
dc.title

A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP

dc.typeOral presentation
dspace.entity.typePublication
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