Publication:

Carrier Systems for Collective Die-to-Wafer Bonding

Date

2022
Proceedings Paper
https://doi.org/10.1109/ectc51906.2022.00324
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Author(s)

Kennes, Koen  
;
Phommahaxay, Alain  
;
Guerrero, Alice
;
Suhard, Samuel  
;
Bex, Pieter  
;
Brems, Steven  
;
Liu, Xiao
;
Tussing, Sebastian
;
Beyer, Gerald  
;
Beyne, Eric  

Journal

na

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1568 since deposited on 2022-09-17
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Acq. date: 2026-09-15

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