Publication:

Carrier Systems for Collective Die-to-Wafer Bonding

Date

2022

Proceedings Paper

https://doi.org/10.1109/ECTC51906.2022.00324

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Author(s)

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Phommahaxay, Alain

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Guerrero, Alice

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Tussing, Sebastian

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Journal

na

Metrics

1564 since deposited on 2022-09-17

Acq. date: 2026-01-06