Publication:

Carrier Systems for Collective Die-to-Wafer Bonding

Date

2022

Proceedings Paper

https://doi.org/10.1109/ECTC51906.2022.00324

Simple item page Full metadata Statistics

Author(s)

;

Phommahaxay, Alain

;

Guerrero, Alice

;

;

;

;

;

Tussing, Sebastian

;

;

Journal

na

Statistics

1564 since deposited on 2022-09-17

Acq. date: 2026-02-28