Publication:

Carrier Systems for Collective Die-to-Wafer Bonding

Date

2022
Proceedings Paper
https://doi.org/10.1109/ECTC51906.2022.00324
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dc.contributor.authorKennes, Koen
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorGuerrero, Alice
dc.contributor.authorSuhard, Samuel
dc.contributor.authorBex, Pieter
dc.contributor.authorBrems, Steven
dc.contributor.authorLiu, Xiao
dc.contributor.authorTussing, Sebastian
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorBrems, Steven
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecBrems, Steven::0000-0002-0282-8528
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2022-11-21T09:57:03Z
dc.date.available2022-09-17T02:52:10Z
dc.date.available2022-11-21T09:57:03Z
dc.date.issued2022
dc.identifier.doi10.1109/ECTC51906.2022.00324
dc.identifier.eisbn978-1-6654-7943-1
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40445
dc.publisherIEEE
dc.source.beginpage2058
dc.source.conference72nd IEEE Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 31-JUN 01, 2022
dc.source.conferencelocationSan Diego
dc.source.endpage2063
dc.source.journalna
dc.source.numberofpages6
dc.title

Carrier Systems for Collective Die-to-Wafer Bonding

dc.typeProceedings paper
dspace.entity.typePublication
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