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Carrier Systems for Collective Die-to-Wafer Bonding
Publication:
Carrier Systems for Collective Die-to-Wafer Bonding
Date
2022
Proceedings Paper
https://doi.org/10.1109/ECTC51906.2022.00324
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Kennes, Koen
;
Phommahaxay, Alain
;
Guerrero, Alice
;
Suhard, Samuel
;
Bex, Pieter
;
Brems, Steven
;
Liu, Xiao
;
Tussing, Sebastian
;
Beyer, Gerald
;
Beyne, Eric
Journal
na
Abstract
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1559
since deposited on 2022-09-17
Acq. date: 2025-10-23
Citations
Metrics
Views
1559
since deposited on 2022-09-17
Acq. date: 2025-10-23
Citations