Browsing by author "Suhard, Samuel"
Now showing items 1-20 of 47
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3D integration challenges for fine pitch back side micro-bumping on ZoneBOND™ wafers
Buisson, Thibault; De Preter, Inge; Suhard, Samuel; Vandersmissen, Kevin; Jaenen, Patrick; Witters, Thomas; Jamieson, Geraldine; Jourdain, Anne; Van Huylenbroeck, Stefaan; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2012) -
3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures
De Preter, Inge; Derakhshandeh, Jaber; Nagano, Fuya; Houshmand Sharifi, Shamin; Hou, Lin; Bex, Pieter; Suhard, Samuel; Shibata, Toshiaki; Yukinori, Oda; Hashimoto, Shigeo; Lieten, Ruben; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2017) -
3D stacking using bump-less process for sub 10μm pitches
Derakhshandeh, Jaber; De Preter, Inge; Gerets, Carine; Hou, Lin; Heylen, Nancy; Beyne, Eric; Beyer, Gerald; Slabbekoorn, John; Dubey, Vikas; Jourdain, Anne; Potoms, Goedele; Inoue, Fumihiro; Jamieson, Geraldine; Vandersmissen, Kevin; Suhard, Samuel; Webers, Tomas; Capuz, Giovanni; Wang, Teng; Rebibis, Kenneth June; Miller, Andy (2016) -
A record GmSAT/SSSAT and PBTI reliability in Si-passivated Ge nFinFETs by improved gate stack surface preparation
Arimura, Hiroaki; Cott, Daire; Boccardi, Guillaume; Loo, Roger; Wostyn, Kurt; Brus, Stephan; Capogreco, Elena; Opdebeeck, Ann; Witters, Liesbeth; Conard, Thierry; Suhard, Samuel; van Dorp, Dennis; Kenis, Karine; Ragnarsson, Lars-Ake; Mitard, Jerome; Holsteyns, Frank; De Heyn, Vincent; Mocuta, Dan; Collaert, Nadine; Horiguchi, Naoto (2019-06) -
Acoustic modulation during laser debonding of collective hybrid bonded dies
Kennes, Koen; Phommahaxay, Alain; Guerrero, Alice; Bumueller, Dennis; Suhard, Samuel; Bex, Pieter; Tussing, Sebastian; Liu, Xiao; Beyer, Gerald; Beyne, Eric (2021) -
Advanced dicing technologies for combination of wafer to wafer and collective die to wafer fusion bonding
Inoue, Fumihiro; Phommahaxay, Alain; Podpod, Arnita; Suhard, Samuel; Hoshino, Hitoshi; Berthold, Moeller; Sleeckx, Erik; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric (2019) -
All-wet removal of post-etch photoresist and sidewall residues: Electrical characterization of 90 nm and 30 nm ½ pitch structures
Le, Quoc Toan; Demuynck, Steven; Suhard, Samuel; Klipp, Andreas; Vereecke, Bart; Vereecke, Guy (2010) -
Carrier Systems for Collective Die-to-Wafer Bonding
Kennes, Koen; Phommahaxay, Alain; Guerrero, Alice; Suhard, Samuel; Bex, Pieter; Brems, Steven; Liu, Xiao; Tussing, Sebastian; Beyer, Gerald; Beyne, Eric (2022) -
Challenges and novel approaches for photo resist removal and post-etch residue removal for 22 nm interconnects
Mertens, Paul; Kim, Tae-Gon; Claes, Martine; Le, Quoc Toan; Vereecke, Guy; Kesters, Els; Suhard, Samuel; Pacco, Antoine; Lux, Marcel; Kenis, Karine; Urbanowicz, Adam; Tokei, Zsolt; Beyer, Gerald (2009) -
Characterization of low-k dielectric etch residue on the sidewall by chemical force microscope
Kim, Tae-Gon; Le, Quoc Toan; Suhard, Samuel; Lux, Marcel; Vereecke, Guy; Claes, Martine; Struyf, Herbert; De Gendt, Stefan; Mertens, Paul; Heyns, Marc (2010) -
Demonstration of a collective hybrid die-to-wafer integration
Suhard, Samuel; Phommahaxay, Alain; Kennes, Koen; Bex, Pieter; Fodor, Ferenc; Beyne, Eric; Liebens, Maarten; Slabbekoorn, John; Miller, Andy; Beyer, Gerald (2020) -
Demonstration of a collective hybrid die-to-wafer integration using glass carrier
Suhard, Samuel; Kennes, Koen; Bex, Pieter; Jourdain, Anne; Teugels, Lieve; Walsby, Edward; Bolton, Chris; Patel, Jash; Ashraf, Huma; Barnett, Richard; Fodor, Ferenc; Phommahaxay, Alain; La Tulipe, Douglas Charles; Beyer, Gerald; Beyne, Eric (2021) -
Development of a wet silicon removal process for replacement metal gate and sacrificial fin
Suhard, Samuel; Sebaai, Farid; Pacco, Antoine; Veloso, Anabela; Carbonell, Laure; Claes, Martine; Struyf, Herbert; Mertens, Paul; De Gendt, Stefan (2011) -
Development of a wet silicon removal process for replacement metal gate and sacrificial fin
Suhard, Samuel; Sebaai, Farid; Pacco, Antoine; Veloso, Anabela; Carbonell, Laure; Claes, Martine; Struyf, Herbert; Mertens, Paul; De Gendt, Stefan (2011) -
Development of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoring
Suhard, Samuel; Iwasaki, Akihisa; Liebens, Maarten; Stiers, Karen; Slabbekoorn, John; Holsteyns, Frank (2016) -
Development of integrated wet cleans for 3D-SIC technologies
Suhard, Samuel; Simms, Ihsan; Brown, Ian; Shogo, Mizota; Koji, Kagawa; Claes, Martine; Buisson, Thibault; Jourdain, Anne; Beyer, Gerald; De Gendt, Stefan (2013) -
Die to wafer 3D stacking for below 10μm pitch microbumps
Derakhshandeh, Jaber; Hou, Lin; De Preter, Inge; Gerets, Carine; Suhard, Samuel; Dubey, Vikas; Jamieson, Geraldine; Inoue, Fumihiro; Webers, Tomas; Bex, Pieter; Capuz, Giovanni; Beyne, Eric; Slabbekoorn, John; Wang, Teng; Jourdain, Anne; Beyer, Gerald; Rebibis, Kenneth June; Miller, Andy (2016) -
Elastocapillary selfassembly of silicon nanopillars
Xu, XiuMei; Vrancken, Nandi; Vereecke, Guy; Pourtois, Geoffrey; Suhard, Samuel; Holsteyns, Frank (2016) -
Enabling ultra-thin die to wafer hybrid bonding for future heterogeneous integrated systems
Phommahaxay, Alain; Suhard, Samuel; Bex, Pieter; Iacovo, Serena; Slabbekoorn, John; Inoue, Fumihiro; Peng, Lan; Kennes, Koen; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric (2019) -
ESH friendly solvent for stripping positive and negative photoresists in 3D-wafer level packaging and 3D-stacked IC applications
Suhard, Samuel; Claes, Martine; Civale, Yann; Nolmans, Philip; Sabuncuoglu Tezcan, Deniz (2012)