Authors

Suhard, Samuel; Iwasaki, Akihisa; Liebens, Maarten; Stiers, Karen; Slabbekoorn, John; Holsteyns, Frank

Conference

IEEE 18th Electronics Packaging Technology Conference - EPTC

Title

Development of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoring

Publication type

Proceedings paper

Embargo date

9999-12-31